Google reportedly books Intel for packaging more than 3 million TPUs in 2028 — SK hynix is testing Intel's EMIB packaging for HBM integrationGoogle has placed an order for Intel to build more than 3 million of its TPUs in 2028 after months of testing Intel's advanced packaging.https://www.tomshardware.com/tech-industry/google-reportedly-books-intel-for-more-than-3-million-tpus-in-2028#Tech #Technology #TechNews #AI #Gadgets #Software #Cybersecurity #Apple #Google #Microsoft #Startup #OpenSource #TomsHardware [Tom's Hardware]
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