Intel is betting big on advanced chip packaging to grab a slice of the AI boom. The company has poured billions into its New Mexico facility, including 500M USD from the US CHIPS Act, to boost advanced packaging that combines multiple chiplets onto custom chips. Intel hopes to compete with TSMC as every major tech company builds custom AI silicon. https://arstechnica.com/gadgets/2026/04/intel-is-going-all-in-on-advanced-chip-packaging/ #AIagent #AI #GenAI #AIInfrastructure
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