TSMC’s dominant grip on AI hardware has a major point of failure: packaging. Yield issues with its advanced CoWoS and InFO packaging processes are threatening to delay high-bandwidth memory shipments. This physical assembly bottleneck is a rare vulnerability for the Taiwanese giant, opening a massive, unexpected window for Intel Foundry Services to step in and capture market share in a highly constrained sector.#AsiaAI #AI #Tech #EastAsiahttps://asiaai.fyi/?p=672
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