Intel patent embeds MicroLEDs in chip packaging — technology may enable embedded optical interconnects through TGVsIntel has showcased a patent it filed in 2022 to embed MicroLEDs inside chip packaging. The company suggests this could be used for diagnostic testing, customized lighting on chip surfaces, but perhaps more importantly,…https://www.tomshardware.com/tech-industry/photonics/intel-patent-embeds-microleds-in-chip-packaging-technology-may-enable-embedded-optical-interconnects-through-tgvs#Tech #Technology #TechNews #AI #Gadgets #Software #Cybersecurity #Apple #Google #Microsoft #Startup #TomsHardware [Tom's Hardware]
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