Researchers at imec published Beyond HBM-on-GPU: Thermal Design Envelope for 3D Volumetric DRAM-on-GPU Integration. They evaluated a 3D memory architecture that rotates DRAM dies vertically above a GPU.Source: Semiconductor Engineeringhttps://semiengineering.com/vertical-dram-stacking-expands-thermal-design-space-beyond-hbm-imec/#AI
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